Power chips are attached to exterior circuits with product packaging, and their efficiency depends on the assistance of the packaging. In high-power situations, power chips are generally packaged as power components. Chip interconnection refers to the electrical connection on the top surface of the chip, which is typically aluminum bonding cord in conventional components. ^
Typical power component bundle cross-section
At present, industrial silicon carbide power components still mostly make use of the packaging technology of this wire-bonded conventional silicon IGBT module. They encounter issues such as large high-frequency parasitic specifications, not enough heat dissipation capacity, low-temperature resistance, and not enough insulation toughness, which restrict using silicon carbide semiconductors. The display of outstanding efficiency. In order to address these issues and totally manipulate the huge prospective advantages of silicon carbide chips, numerous new packaging technologies and solutions for silicon carbide power components have actually arised in recent times.
Silicon carbide power component bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have created from gold wire bonding in 2001 to light weight aluminum cord (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have created from gold cables to copper wires, and the driving force is price reduction; high-power tools have actually created from aluminum cords (strips) to Cu Clips, and the driving pressure is to boost item performance. The higher the power, the greater the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that utilizes a solid copper bridge soldered to solder to link chips and pins. Compared with standard bonding product packaging methods, Cu Clip modern technology has the following advantages:
1. The link between the chip and the pins is made from copper sheets, which, to a certain degree, changes the common cord bonding method in between the chip and the pins. For that reason, an unique package resistance value, greater current circulation, and far better thermal conductivity can be acquired.
2. The lead pin welding area does not need to be silver-plated, which can totally save the expense of silver plating and inadequate silver plating.
3. The item look is entirely constant with regular items and is mostly made use of in web servers, mobile computer systems, batteries/drives, graphics cards, electric motors, power materials, and other fields.
Cu Clip has 2 bonding methods.
All copper sheet bonding approach
Both the Gate pad and the Source pad are clip-based. This bonding technique is extra pricey and intricate, yet it can achieve much better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus cable bonding technique
The resource pad utilizes a Clip method, and the Gate makes use of a Cord technique. This bonding method is somewhat cheaper than the all-copper bonding method, saving wafer area (applicable to extremely small entrance locations). The procedure is simpler than the all-copper bonding approach and can obtain much better Rdson and better thermal impact.
Provider of Copper Strip
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